Products
Material: KB6160(Tg135)
Stack-up: 1.6MM with 1oz std
HASL Finish
Material: TU-768(Tg175)
Stack-up: L1-L2/L2-L3/L4-L5/L5-L6/L1-L6
Material: S1000-2(Tg175)
Stack-up: 16L with 1oz
ENIG 3U''
Material: S000-2(Tg175)
Stack-up: 1.6MM std
Min. line&width 4/4mil
Material: IT180A(Tg175)
Stack-up: 6L with 3oz
ENIG 2U''
Material: TU-768(Tg175)
Stack-up: 2.0MM std
Min. line&width 4/4mil
Material: S1000(Tg150)
BGA
Surface: ENIG 3U''
Size:3MMx3MM,Meterial:TU768(Tg175)
0.2mm connect holes L1-L2/L1-L3/L1-L6/L3-L5/L4-L5/L4-L6/L6-L8/L7-L8
Material: KB6160(Tg135)
Stack-up: 10L std
Surface: HASL-LF
Material: S1000-2(Tg175)
Board Thickness: 5.0MM
Stack-up: 4L with 10oz