Max. Layer Count: 32 Layers

Max. Copper Thickness: 8oz inner & 20oz outer layer

Min. Line Width&Space: 2.5/2.5mil

Min. Mechanical Drilling Hole Size: 0.15mm and Laser 0.1mm.

Aspect Ratio: =<16:1

Max. Board Thickness: 12mm

Surface Treatment: HASL-LF, ENIG, OSP, Immersion Silver/Tin, Gold Plating, Peelable mask, Carbon Ink, etc

Laminate Supply: FR4, HiTg, AL, Copper base, High Frequency, PTFE, etc

For more acknowledgement, please contact us.